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Hi.
I have bought the below bench top wafer baking machine and it seems working great.
Just that i will get slightly thicker thickness of the wafer in the middle compare to its side. The texture at the side is soft crunch, but the middle thick part is soggy and not crunchy at all. If i were to bake longer, the whole piece texture became a bit hard eventhough the middle thick part is cooked, but the texture is still prone to a bit hard.
Maybe you could share some experiences on this and provide some advices on how to obtain a more even thickness of the wafer biscuits?
Recipe and process parameters as below:
Recipe (Baker's %): Flour (8.5-9.5% protein) 100%, water (T=17degC) 175%, sodium bicarbonate 0.1%, salt 0.4%, oil 4%, lecithin (liquid form) 0.1%
Used hand mixer mixed at fast speed for 2min30sec.
Batter T = 18-20degC
Hot plate T setting = 160degC (i have tried baking at 180degC for 2m15sec. The texture is a bit hard). (I think baking parameters is the most important parameter to control for wafer biscuits as the recipe basically very simple).
Baking time = 2m45sec
Cooling time = 2min
End with packing.
Thank you in advance :)
Regards,
Amye
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