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Besides heat increase in first zones, docker pin distribuition, and opening of oven extraction, is there any other mean (in process or recipe) to cause more and bigger blisters in a thin salted laminated biscuit?
Any advantages in using lactic acid instead of the common acid salts? Could this impact on rancidity more than these salts? SAPP and MCP are cheaper than lactic acid here.
Thanks in advance,
Has anyone ever tried to make
laminated biscuits (snack cracker type) in steel oven band? Besides the
blisters that may occur under the dough pieces, any other potential issues related to
heat transfer limitation (development, stack height...
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