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Asked on 26.02.2020.
Fat for cream filling in sandwiching secondary process

Good morning, can someone help me with this issue: Which is the technical specification for the fat (Palm) used in secondary process for the cream of sandwich and wafer filling?

Answered on 27.02.2020.
Phillip I am a fat expert and before I can support you I want to know first what you mean with secondary process.
Do you use the cream between wafers or between biscuits
Answered on 27.02.2020.

Thank you Mr. Gabrie. I mean as secondary process: the process of filling biscuits or wafer sandwich.

I want to know the specifications of fat used in creams for:

1.Biscuit sandwich filling

2. Flat wafer filling

Thank you

Answered on 27.02.2020.
For wafer fillings usually Coconut oil is used as fat. Possibly you can use Palmoil but that is slower crystallising and can give problems in the subsequent process. Also taste is different (does not melt so well).

For Biscuit sandwhich filling is more difficult.
The type of fat is depending on the maximum distribution/storage temperature and the fatlevel in the filling. In warmer countries  palmstearin is applied. Not so good but it works. In the past and in Europe fats based on Palmkernel or Coconut and the fully hardned versions are applied.
Answered on 29.02.2020.

Dear Philip,

I have been using for Flat Wafers a Mixture of Hydrogenated Palm Oil and non Hydrogenated Palm Oil apart from Coconut Oil.

Hydrogenated Palm Oil, SFC 20 C: 56, SFC 30: 38, SFC 40 C: 25,

Non Hydrogenated Palm Oil, SFC 20C:  50, SFC 30: 15, SFC 40: 10 

Depending on the ambient temperature I have been shifting from a "Winter Version" to a "Summer Version" (most heat tolerant) adjusting the proportions of each one.

Thank you.

Answered on 01.03.2020.

1.Biscuit sandwich filling: palm, cotton, sunflower, canola combination

control parameters unit target max min
refractive index (nD50) 0.000 1.457 1.455
peroxide value PPM 0.00 1.00 0.00
S.F.C. (20°C) % 0 25 19

S.F.C. (30°C) % 0 12 8

S.F.C. (35°C) % 0 9 6

Saponification PPM 0 5 0
Free fatty acids (Oleic acid) % 0.00 0.15 0.00
Trans fat % 0.00 1.00 0.00
fat ratio % 0.0 0.0 99.9
(Pb) MPM 0.0 0.1 0.0

2. Flat wafer filling: coconut 

PEROXİDE VALUE MQO 0.00 1.00 0.00
S.F.C. (20°C) % 0.0 58.0 48.0
S.F.C. (30°C) % 0.0 7.0 3.0
S.F.C. (35°C) % 0.0 3.0 0.0
FREE FATTY ACIDS (OLEIC ACID) % 0.00 0.15 0.00
TRANS FAT M% 0.00 1.00 0.00
FAT RATIO M% 0.0 0.0 99.9

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