Good morning, can someone help me with this issue: Which is the technical specification for the fat (Palm) used in secondary process for the cream of sandwich and wafer filling?
Thank you Mr. Gabrie. I mean as secondary process: the process of filling biscuits or wafer sandwich.
I want to know the specifications of fat used in creams for:
1.Biscuit sandwich filling
2. Flat wafer filling
Thank you
Dear Philip,
I have been using for Flat Wafers a Mixture of Hydrogenated Palm Oil and non Hydrogenated Palm Oil apart from Coconut Oil.
Hydrogenated Palm Oil, SFC 20 C: 56, SFC 30: 38, SFC 40 C: 25,
Non Hydrogenated Palm Oil, SFC 20C: 50, SFC 30: 15, SFC 40: 10
Depending on the ambient temperature I have been shifting from a "Winter Version" to a "Summer Version" (most heat tolerant) adjusting the proportions of each one.
Thank you.
1.Biscuit sandwich filling: palm, cotton, sunflower, canola combination
control parameters | unit | target | max | min |
refractive index (nD50) | 0.000 | 1.457 | 1.455 | |
peroxide value | PPM | 0.00 | 1.00 | 0.00 |
S.F.C. (20°C) | % | 0 | 25 | 19 |
S.F.C. (30°C) | % | 0 | 12 | 8 |
S.F.C. (35°C) | % | 0 | 9 | 6 |
Saponification | PPM | 0 | 5 | 0 |
Free fatty acids (Oleic acid) | % | 0.00 | 0.15 | 0.00 |
Trans fat | % | 0.00 | 1.00 | 0.00 |
fat ratio | % | 0.0 | 0.0 | 99.9 |
(Pb) | MPM | 0.0 | 0.1 | 0.0 |
2. Flat wafer filling: coconut
CONTROL PARAMETERS | UNIT | TARGET | MAX | MIN |
PEROXİDE VALUE | MQO | 0.00 | 1.00 | 0.00 |
S.F.C. (20°C) | % | 0.0 | 58.0 | 48.0 |
S.F.C. (30°C) | % | 0.0 | 7.0 | 3.0 |
S.F.C. (35°C) | % | 0.0 | 3.0 | 0.0 |
FREE FATTY ACIDS (OLEIC ACID) | % | 0.00 | 0.15 | 0.00 |
TRANS FAT | M% | 0.00 | 1.00 | 0.00 |
FAT RATIO | M% | 0.0 | 0.0 | 99.9 |