Good morning, can someone help me with this issue: Which is the technical specification for the fat (Palm) used in secondary process for the cream of sandwich and wafer filling?
Thank you Mr. Gabrie. I mean as secondary process: the process of filling biscuits or wafer sandwich.
I want to know the specifications of fat used in creams for:
1.Biscuit sandwich filling
2. Flat wafer filling
I have been using for Flat Wafers a Mixture of Hydrogenated Palm Oil and non Hydrogenated Palm Oil apart from Coconut Oil.
Hydrogenated Palm Oil, SFC 20 C: 56, SFC 30: 38, SFC 40 C: 25,
Non Hydrogenated Palm Oil, SFC 20C: 50, SFC 30: 15, SFC 40: 10
Depending on the ambient temperature I have been shifting from a "Winter Version" to a "Summer Version" (most heat tolerant) adjusting the proportions of each one.
1.Biscuit sandwich filling: palm, cotton, sunflower, canola combination
|refractive index (nD50)||0.000||1.457||1.455|
|Free fatty acids (Oleic acid)||%||0.00||0.15||0.00|
2. Flat wafer filling: coconut
|FREE FATTY ACIDS (OLEIC ACID)||%||0.00||0.15||0.00|